Ceramic housings for diode

Ceramic housings for diode

 

Specifications
Technical
  • Flatness of copper surface:≤0.005mm
  • Parallelism between copper surfaces:≤0.03mm
  • Concentricity between flange and copper:≤0.5mm
  • Leak rate:≤1×10-8 mbarl/s
  • Pull test:≥5kN/cm2
  • Temperature cycling:-65℃~200℃
  • Plating thickness:2-7μm
Main material
  • Ceramic:92%min Al2O3
  • Glaze:Color transparent
  • Flange:SE·Cu or Fe58Ni42(Alloy42) or KOVAR
  • Copper contact:OF·Cu
  • Solder:Ag72Cu28

 

TYPE Ø D (OD flange) Ø D1 (OD ceramic) Ø d1 (ID ceramic) Ø d (OD contact) h
34 mm 57 53 40 34 24
47 mm 73 67 54,5 47 24
63 mm 100 93,5 78 63 23
73 mm 109 100 81 73 24; 35
80 mm 118 109 88 80 32
etc.          
special housings          

 


Contact

Alumina Systems s.r.o.

Kladska 916/65
Hradec Kralove
50003
CZECH REPUBLIC


+420 495 407 549


 



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